Huawei Unveils Faster and More Powerful "Kirin 2026" Chip

He Tingbo, the head of the semiconductor division of the Chinese technology giant Huawei, has announced a new technological breakthrough that will create a major turning point in chip manufacturing. This new discovery makes it possible to fundamentally increase the performance of microchips (chips) not by downscaling their physical size, but by changing their structural system (architecture).

Currently, according to "Moore's Law" used in global chip production, the power of microchips is increased through the physical compression and shrinking of components. However, current technology has reached the limits of further reducing the physical size of components.

To overcome this obstacle, Huawei is implementing a reliance on "Tao's Law" instead of conventional geometric downsizing. In this method, time scale (temporal scalability) is taken as a basis rather than the physical size of the chips, ensuring the seamless and extremely fast transmission of the data signal.

This new innovation is carried out through a method called "logical folding." In this process, the chip's structure is divided and arranged into several dense and compact layers to optimize data pathways. Consequently, the signal path is shortened, and the speed of processing tasks locally is further accelerated.

According to the information provided by the head of the company, He Tingbo, the first mobile chip prepared on the basis of this innovative principle, which possesses high energy efficiency—the "Kirin 2026"—will be introduced to the global market by the end of this year and will begin to be used in new smartphones.

This technological leap will help to further strengthen China's manufacturing independence and technological power in the global chip competition.